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In situ UV Epoxy Dispensing, Die Bonding & Curing
One challenge in building photonic devices such as Active Optical Cables (AOC) is to ensure extremely accurate post die bond positioning of lenses or other critical devices. In situ UV epoxy curing results in more accurate post bond placement by eliminating movement during thermal curing. Parts are held in place during UV curing, which drives higher accuracies and thus higher product yield.
MRSI ultra-precision die bonders are available with fully integrated UV curing. Features
include specialized UV epoxy processes and dispense hardware, including easy-clean, accurate time/pressure dispense pumps for short pot-life materials. In addition, dispense needle auto-shutter light guards ensure that the dispense needle tips do not clog due to inadvertent UV exposure. Safety considerations include light tight enclosure with electrical interlocks and UV safety glass windows. Flexible fixturing design and adjustable UV light paths provide the flexibility needed for a wide range of package geometries and types.
The UV light source can be LED or lamp. The UV lamp provides a broad spectrum of light delivered through a light guide. LED sources are more flexible and reduce fixturing costs. Interchangeable LED heads provide the required wavelength of light for specific UV epoxy materials.
Features and benefits include:
- Specialized dispense hardware for ease-of-use
- Dispense needle guards for a robust, high uptime process
- Safety considerations for operator safety
- Flexible fixturing design to accommodate multiple part types
- Adjustable light paths allow many part geometries
- LED UV light option simplifies required fixturing
- UV lamp cure for broad spectrum UV curing
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