April 2023


  • Machine Tip of the Month
  • MRSI Employee Spotlight - Francesca Lynch
  • Software Training Video Update 
  • Smash The Trash! - Sustainability
  • Trade Shows Updates
  • Blog Insights

Machine Tip of the Month

One of the various elements within our machines is fly height. The fly height and camera level are crucial to reducing cycle time. In a machine, you want the fly height to be high enough so the tip can clear the highest point on the worktable. By optimizing the fly height, you eliminate the unnecessary extra z movement.


Probing height is the camera safe height for cameras one and two on our die bonders. During pick or place, the z movement slows down when it gets to the probing height. By reducing the probing height, you are also reducing the probing time, which reduces cycle time.

Software Training Video Program Update

MRSI has produced immersive software training videos to optimize your company’s experience with our cutting-edge die bonding and epoxy dispensing systems.


The following three videos have been released:


  1. Teach Waffle Pack Single Point
  2. Teach Waffle Pack Large Pocket Two Points
  3. Teach Die Single Picture Boundary Trade with Checkpoints and Pick Offset


Register at this link.

MRSI Employee Spotlight - Francesca Lynch

Meet MRSI Systems' Project Manager, Francesca Lynch. Francesca is known for her enthusiasm, articulate communication skills, wisdom, and her magnetic charisma. As a project manager at MRSI Systems, Francesca is responsible for gathering customer requirements for machine orders and then working with the functional groups to plan the machine's design and build schedules. Further, Francesca is also the product manager for our 175Ag line. She is responsible for understanding what customers like and what they want improved, how we stay competitive against other dispensers, which new features to implement, gross margin improvement, sales forecasts, etc. Beyond her professional success, Francesca shed some light on her personal endeavors.


Francesca lives an abundant, joyful life surrounded by her family and friends. In her free time, she loves to host pool parties at her home, watch her son and fiancé play soccer, and travel. She recalled how transformative and blissful her trips to St. Thomas and Mexico were. Her ultimate travel goals are to go to Australia to hug a koala. If she could give any advice to her younger self, it would be “Embrace change, you only get one life, so make the best of whatever you’re given.”


We are so grateful to have a presence like Francesca at MRSI. Her consistency, dependability, and constant drive to improve is an inspiring force here. We cannot wait to see what else Francesca will accomplish in her time here!

Sustainability Initiative

Mycronic US started a new sustainability initiative “Smash the trash” in October 2022 which had these results:

  • Reduced trash pickups by 29%
  • Reduced recycling needed by 22% and pickups by 33% for the second half of 2022

Trade Show News

IMAPS New England

Boxborough, MA

May 2, 2023

Booth #406


MRSI Systems is delighted to announce another opportunity to see us this spring. We will be a featured Platinum Sponsor along with exhibiting at the upcoming 49th annual IMAPS New England Symposium and Exhibition.


Jack Inocencio, Sr. Manager of Applications & Services at MRSI Systems, will be presenting “Advanced Packaging for Heterogenous Integration.” The abstract of his speech reads “Advanced heterogenous integration for 3-D IC packaging, e.g chiplet, and optoelectronics packaging requires high precision die bonders that can perform many different processes, such as thermal compression bonding, DAF bonding, BGA/copper pillar bonding, eutectic bonding, hybrid bonding and more. In this talk, the industry leading WLP (Wafer Level Packaging) solution from MRSI with sub-micron accuracy will be presented.”

Register
Schedule Meeting

CHIP China Conference

May 23-24, 2023

Suzhou, China


Dr. Limin Zhou will also be presenting "New challenges in assembly of advanced compound semiconductor chips."


This speech touches on how chip assembly technology plays a crucial role in emerging fields such as modern information technology, 5G communication technology, artificial intelligence, electric vehicles, and green energy.


Learn more about the CHIP China conference

International Microwave Symposium

Visit us to discuss you die bonding requirements

San Diego, CA

Booth #2243

Exhibition Hours

  • Tuesday, 13 June 2023: 09:30-17:00
  • Wednesday, 14 June 2023: 09:30-18:00
  • Thursday, 15 June 2023: 09:30-15:00
Contact Us
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