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The MRSI-705 has solidified its reputation as a reliable tool within the aerospace, defense, and medical industries, serving as a linchpin for mission-critical tasks thanks to its blend of performance, adaptability, and dependability. Let's delve into its key features and enhancements:
Key Features and Specifications:
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Accuracy: Boasting an impressive accuracy of 5µm @ 3σ, the MRSI-705 ensures precision in every operation, crucial for demanding applications.
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High Stability Platform: Its stable platform provides a reliable foundation, essential for consistent and accurate performance even under challenging conditions.
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Programmable Force Control: Offering programmable force control per placement with real-time feedback, it ensures precise and adaptable operations tailored to specific requirements.
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Place-to-Force and Place-to-Height Capabilities: These features enhance its versatility, accommodating various placement needs efficiently.
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Material Compatibility: Supporting a range of materials including eutectic, epoxy (suitable for stamping, dispensing, and UV curing), it meets diverse application demands effectively.
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Large Work Area: With a spacious work area, the MRSI-705 facilitates flexible tooling and material handling options, enhancing operational efficiency.
New Features:
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Patented Turret Tool Changer: The addition of a patented turret tool changer, capable of mounting 12 tools and executing changes within a remarkable 0.5 seconds, is a game-changer. It significantly enhances throughput, making it ideal for high-volume applications.
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Heated Bonding Head: The integration of a heated bonding head allows for localized heating through the die, meeting the critical requirement for tasks involving solder pre-deposition in multiple locations on the substrate for multiple dies. This feature ensures precision and efficiency in complex bonding processes.
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High Force Bonding System: With a high force (500N) bonding system coupled with a heated head, the MRSI-705 expands its capabilities to include thermal compression bonding, ACF bonding, and silver sintering for power semiconductor packaging. This makes it a versatile solution for a wide range of bonding applications, including those requiring critical epoxy bonding.
Overall, the MRSI-705 continues to evolve, incorporating new features and enhancements that further solidify its position as a trusted tool for critical applications in the aerospace, defense, and medical industries. Its combination of precision, flexibility, and reliability makes it a valuable asset for companies operating in demanding environments.
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