Precision XY Saw Cutting & Grooving

of Glass, Wafers & Filters

Abrisa Technologies offers Precision XY Saw Cutting services utilizing processes originally developed for semiconductor wafer dicing. The camera assisted array saw cutting method is ideal when parts are rectangular and volumes high as well as when parts are small or when parts require XY dimensional  tolerances such as 0.025mm with consistent perpendicularity of edges to faces.

Ideal for:

• High Volume, Small Part Fabrication
• Filters, Mirrors, Windows, Beam Splitters, Sights
• Precision Fit Rectangular Components
• 100% Clear Aperture Parts
• Wafer or Filter Glass Master Formats 

Abrisa Technologies Publishes NEW Capabilities Brochure

We have just published our NEW Capabilities Brochure adding a host of new Coatings and Value-Add capabilities, so click on the links below to learn more.

Major Product/Service Sections include:

• Specialty & Technical Glass
• Custom Glass Fabrication
• Glass Strengthening
• Precision Thin Film Coatings
• Transparent Conductive Coatings (ITO/IMITO)
• Coatings for Defense & IR Spectrum
• Coatings for Imaging, Sensing & Scanning
• Robust Screen Printed Graphics
• Ready-to-Install Value-Added Services
• Services for Customer Furnished Material